TOPPAN and eYs3D Launch Strategic Co-Promotion of Joint Edge AI 3D Vision Solution Ahead of COMPUTEX 2026
Table of Contents
Low-Latency 3D Mapping and On-Site Autonomous Processing for Next-Generation AMR and Industrial Automation
TOPPAN Holdings Inc. and eYs3D Microelectronics Co. have announced the launch of a strategic co-promotion initiative aimed at accelerating the adoption of their jointly developed Edge AI vision sensing solution.
As the flagship milestone of this co-promotion, the complete hardware and software integrated reference design will be unveiled for the first time with live demonstrations at COMPUTEX 2026 in Taipei, Taiwan.
This integrated solution addresses key challenges in automation by closing the gap between high-performance 3D data acquisition and on-site intelligence processing.
System Architecture and Unified System Benefits
By directly connecting the “senSPure™ module (powered by hybrid ToF™)” uniquely developed by TOPPAN to eYs3D’s “XINK Nano platform” equipped with the dedicated eCV5546 AI SoC, this system eliminates the processing delays and high structural costs inherent in traditional vision architectures.
The jointly developed integrated system delivers the following mutual benefits.
- Zero-Delay Edge Intelligence
Heavy AI algorithms and 3D depth calculations that cause high processing loads are handled directly on the edge side by the dedicated NPU and Quad-Core Arm® Cortex®-A55, eliminating any reliance on external host PCs or the cloud. Therefore, ultra-low latency autonomous reactions for industrial equipment are guaranteed.
- High-Precision Spatial Awareness
By directly incorporating Depth and IR data—which maintains robust recognition accuracy even under severe sunlight up to 100,000 lx—into the edge AI pipeline, the system can accurately recognize the physical dimensions, precise boundaries, and volumetric sizes of objects.
- Scalable Device Management
In collaboration with the cloud-native SaaS platform “XINK Connect,” it enables remote connection, monitoring, optimization, and AI model deployment for multiple vision devices, extending edge-side sensing into a centralized, cloud-based, and efficient fleet operation.
Live Demonstration and Cross-Industry Horizontal Deployment
At COMPUTEX 2026, the primary demonstration will showcase a smart agriculture application, featuring real-time livestock size measurement and automated status monitoring within unpredictable barn environments.
This system architecture is engineered from the ground up for immediate horizontal deployment into robotics and factory automation fields. This expands the solution from edge-level AI sensing and inference to cloud-based device management and intelligent operations, enabling scalable deployment across a wide range of Edge AI Vision applications, including smart agriculture, robotics, industrial automation, smart logistics, healthcare, security, and smart cities.
Event Overview (COMPUTEX 2026)
| Parameter | Details |
|---|---|
| Event Name | COMPUTEX 2026 |
| Date | June 2 – June 5, 2026 |
| Location | Taipei Nangang Exhibition Center, Taipei, Taiwan |
| Booth | L0401a TaiNEX Hall1 |
| Featured Technologies | TOPPAN senSPureTM hybrid ToFTM Camera Module eYs3D XINK Nano Edge AI Platform (eCV5546) |
| Target Applications | AMRs, AGVs, Industrial Automation, Smart Logistics, Smart Agriculture |
About eYs3D Microelectronics
eYs3D Microelectronics Co. is a pioneer in 3D sensing technologies, focusing on semiconductor solutions and products for 3D stereo vision and intelligent sensing integration. Leveraging its expertise in memory technologies and computer vision, as well as close collaboration with ARM and its parent company Etron Technology, eYs3D is developing advanced computer vision chips and subsystem products with strong technological differentiation.
The company targets blue-ocean markets including intelligent edge devices, IoT, industrial applications, and service robots, with the goal of becoming a leader in next-generation computer vision processors.
For more information, please visit: www.eys3d.com [→]