New paper has been accepted to the JSSC in Feb. 2023

We would like to share with you our newly accepted paper.

Our paper titled “A Hybrid ToF Image Sensor for Long-Range 3D Depth Measurement Under High Ambient Light Conditions” was submitted to the IEEE Journal of Solid-State Circuits and was accepted in February 2023.

2023.2 IEEE Journal of Solid-State Circuits

Title:
A Hybrid ToF Image Sensor for Long-Range 3D Depth Measurement Under High Ambient Light Conditions

Abstract:
A new indirect time of flight (iToF) sensor realizing long-range measurement of 30 m has been demonstrated by a hybrid ToF (hToF) operation, which uses multiple time windows (TWs) prepared by multi-tap pixels and range-shifted subframes. The VGA-resolution hToF image sensor with 4-tap and 1-drain pixels, fabricated by the BSI process, can measure a depth of up to 30 m for indoor operation and 20 m for outdoor operation under high ambient light of 100 klux. The new hToF operation with overlapped TWs between subframes for mitigating an issue on the motion artifact is implemented. The sensor works at 120 frames/s for a single subframe operation. Interference between multiple ToF cameras in IoT systems is suppressed by a technique of emission cycle-time changing.

This technical paper is available for reading at the following link. And we will be sharing more technical information about this publication here at a later date.

See you soon!

DOI: 10.1109/JSSC.2023.3238031